The trend in lowered prices in the LED market has not changed. With LED chip prices expected to drop substantially in the next few years, packaging is also facing pressure to lower costs. According to current LED component costs, package costs make up 60 percent of the overall cost. U.S. DOE estimates that LED package costs will drop 50 percent by 2016. Advantages in Epoxy Molding Compound (EMC) lead frames in galvanizing high electrical currents, having UV resistance, and ability to withstand high temperatures has draw the attention of package manufacturers.